Five points to note in the use of splatterburst targets

       Splatterburst targets have high requirements during use, such as purity, size, grain size uniformity, etc. These high requirements make us pay more attention to when using splatterburst targets. The following briefly describes the precautions during the use of the five-point splatterburst targets.

        1. Sputtering preparation

       The cleanliness of the vacuum chamber and the sputtering system is very important. Any residues formed by lubricating oil, dust and pre-coating will collect moisture and other contaminants, which will directly affect the vacuum degree and increase the possibility of film formation failure. When short circuit or target arc starting, due to the uncleanness of the sputtering chamber, sputtering gun and target, the film-forming surface is rough and the content of chemical impurities exceeds the standard.
       In order to maintain the composition of the coating, the sputtering gas (argon or oxygen) must be clean and dry, and the air in the sputtering chamber must be evacuated after the substrate is loaded to achieve the vacuum required by the process.

      2. Target cleaning

      The purpose of target cleaning is to remove possible dust or dirt on the surface of the target.

       Three, target installation

       Regarding the important things that need to be paid attention to during the installation of the target, ensure that a good thermal connection is established between the target and the cooling wall of the sputtering gun. When the warpage of the cooling stave or the backplane is serious, it will cause the target to crack or bend during installation, and the thermal conductivity of the back target to the target will also be greatly affected. It will cause the heat to be unable to dissipate during the sputtering process and cause the target to crack or miss the target.

      Four, short circuit and tightness inspection

      After the target is installed, the entire cathode needs to be inspected for short circuit and tightness. It is recommended to use a resistance meter to shake the meter to determine whether there is a short circuit. When it is determined that there is no short circuit in the cathode, a leak detection check can be carried out, and water is passed into the cathode to determine whether there is a water leak.

       Five, target pre-sputtering

       For target pre-sputtering, pure argon gas is recommended for sputtering, because it can clean the surface of the target. When the target is pre-sputtered, it is recommended to increase the sputtering power slowly. The recommended power increase rate for ceramic targets is 1.5Wh/cm². The pre-sputtering speed of metallic targets can be faster than ceramic targets.